OIS

AX120-86 Wafer Inspection System
• 6” / 8” wafer (SEMI Standard)
• Open cassette / SEMI Standard SMIF Pod Opener (configured up to 2x)
• 4-axis ATM robot autoloader, macro (top/back) and micro-inspection
• Wafer pre-aligner
• Integrated with Olympus / Evident MX63 / BXC microscope
• Manual / Motorised stage with vacuum chuck
• Wafer mapping system (SEMI Standard)
• Bin / Defect management
• Anti-vibration platform
• TCP/IP Communication platform
• SECS/GEM (Optional)
• OHT / AGV (SEMI Standard) (Optional)
• HEPA FFU (Optional)

AX120-12 Wafer Inspection System
• 8” and 12” wafer (SEMI Standard)
• Load port: SEMI Standard FOUP / FOSB / Open Cassette (configured up to 2x)
• 4-axis ATM robot autoloader, macro (top/back) and micro-inspection
• Wafer pre-aligner
• Integrated with Olympus / Evident MX63L / BXC microscope
• Manual / Motorised stage with vacuum chuck
• Wafer mapping system (SEMI Standard)
• Bin / Defect management
• Anti-vibration platform
• TCP/IP Communication platform
• SECS/GEM (Optional)
• OHT / AGV (SEMI Standard) (Optional)
• HEPA FFU (Optional)

EAX3000 / AX3000 Wafer Inspection System
• 8” and 12” wafer (SEMI Standard)
• Load port: SEMI Standard FOUP / FOSB / Open cassette (configured up to 2x)
• 4-axis ATM robot autoloader, macro (top/back) and micro-inspection
• Wafer pre-aligner
• Integrated with Olympus / Evident MX63L / BXC microscope
• Manual / Motorised stage with vacuum chuck
• Wafer mapping system (SEMI Standard)
• Bin / Defect management
• Anti-vibration platform
• TCP/IP Communication platform
• SECS/GEM (Optional)
• OHT / AGV (SEMI Standard) (Optional)
• HEPA FFU (Optional)

EAX3000 / AX3000 Wafer Inspection System
• 8” and 12” wafer (SEMI Standard)
• Load port: SEMI Standard FOUP / FOSB / Open cassette (configured up to 2x)
• 4-axis ATM robot autoloader, macro (top/back) and micro-inspection
• Wafer pre-aligner
• Integrated with Olympus / Evident MX63L / BXC microscope
• Manual / Motorised stage with vacuum chuck
• Wafer mapping system (SEMI Standard)
• Bin / Defect management
• Anti-vibration platform
• TCP/IP Communication platform
• SECS/GEM (Optional)
• OHT / AGV (SEMI Standard) (Optional)
• HEPA FFU (Optional)

EAX3000 / AX3000 Wafer Inspection System (Customised)
• 8” and 12” wafer (Non-SEMI Standard)
• Load port: SEMI Standard FOUP / FOSB / Open Cassette (configured up to 2x)
• 4-axis ATM robot autoloader, macro (top/back) and micro-inspection
• Wafer pre-aligner (Bernoulli / Edge-Grip)
• Integrated with Olympus / Evident BXC microscope
• Motorised stage with vacuum / edge-grip chuck
• Wafer mapping system (SEMI Standard)
• Bin / Defect management
• Anti-vibration platform
• TCP/IP Communication platform
• SECS/GEM (Optional)
• OHT / AGV (SEMI Standard) (Optional)
• HEPA FFU (Optional)

AL120-128-WM Wafer Inspection System
• 8” and 12” wafer (SEMI Standard)
• Load port: SEMI Standard FOUP /FOSB / Open Cassette
• Olympus AL120-LMB128 Wafer autoloader, macro (top/back) and micro-inspection
• Integrated with Olympus / Evident MX61L / MX63L microscope
• Motorised stage with vacuum chuck
• Wafer mapping system (SEMI Standard)
• Bin / Defect management
• Anti-vibration platform
• TCP/IP Communication platform
• SECS/GEM (Optional)

AL120-86-WM Wafer Inspection System (Bench-top)
• 6” and 8” wafer (SEMI Standard)
• Load port: SEMI Standard Open Cassette
• Olympus AL120-LMB86 Wafer autoloader, macro (top/back) and micro-inspection
• Integrated with Olympus / Evident MX61 / MX63 microscope
• Motorised stage with vacuum chuck
• Wafer mapping system (SEMI Standard)
• Bin / Defect management
• Anti-vibration platform
• TCP/IP Communication platform
• SECS/GEM (Optional)

SI200 / 300 Wafer Inspection System
• 8”and 12”” Sawn Wafer
• Load port: Open Cassette
• Wafer autoloader and micro-inspection
• Integrated with Olympus / Evident BXC microscope
• Motorised stage with vacuum chuck
• Wafer mapping system (SEMI Standard)
• Bin / Defect management
• Anti-vibration platform
• TCP/IP Communication platform
• SECS/GEM (Optional)

SI200 / 300 Wafer Inspection System
• 8”and 12”” Sawn Wafer
• Load port: Open Cassette
• Wafer autoloader, macro (top / back) and micro-inspection
• Integrated with Olympus / Evident BXC microscope
• Motorised stage with vacuum chuck
• Wafer mapping system (SEMI Standard)
• Bin / Defect management
• Anti-vibration platform
• TCP/IP Communication platform
• SECS/GEM (Optional)

VS100 Post Bonded Inspection System (Bench-top)
• Lead frame / Substrate post-bonded wire / die inspection
• Loading: single magazine
• Integrated with 2D / Stereo visual microscope inspection
• Motorised stage with clamper / holder
• User-friendly UI / HMI
• Strip mapping system (SEMI Standard)
• Bin / Defect management
• TCP/IP Communication platform
• SECS/GEM (Optional)

VS1000 Post Bonded Inspection System
• Lead frame / Substrate post-bonded wire / die inspection
• Loading: single magazine
• Integrated with 2D / Stereo visual microscope inspection
• Motorised stage with clamper / holder
• User-friendly UI / HMI
• Strip mapping system (SEMI Standard)
• Bin / Defect management
• TCP/IP Communication platform
• SECS/GEM (Optional)